Upcoming Qualcomm Snapdragon chipset, the Snapdragon 855 (SDM855), will be the very first commercially-released 7-nanometer processor.7nm refers to the half-pitch measurement of nodes in a chip. In other words, if you were to measure the amount of space between a node and its closest node neighbor, and that measurement was 14 nanometers, you would have yourself a half-pitch of 7nm.
We haven’t many details about the upcoming Qualcomm’s chipset. All we knew was that the newest SoC would be manufactured on a 7nm process, a new technology that will be more power efficient than the 10nm present in the Snapdragon 845. Other rumors have been putting the manufacture of the newest chipset on the hands of TSMC.
Qualcomm won’t say it, but their contractors do. Snapdragon 855 (SDM855) is the first 7nm SoC. (probably the one the X24 modem ends up in) pic.twitter.com/Ot1J34fQoG
— Roland Quandt (@rquandt) February 15, 2018
The chipset will be codenamed as SDM855 and will be branded as Qualcomm’s Snapdragon 855 Fusion Platform and will feature the recent unveiled SDX50 5G Modem – Qualcomm’s first 5G modem that is stated to be commercially available in 2019.
We can’t imagine other meaning for the “Fusion Platform” other than a possible integration of smart AI features in the processor, to the point of making it more than just a “Mobile Platform” like previous Snapdragon chipsets. Since Kirin 970 debut packing Smart AI features, we are pretty sure that other manufacturers will take it as the newest hot trend for mobile processors. Worth noting that Apple most recent processor also was called “Fusion” A10 SoC.
Apart from our speculation around Fusion meaning AI, there may be another reason for this branding. Since the Snapdragon 855 will feature the SDX50 5G Modem, the first Qualcomm integration of a 5G capable modem in a mobile processor could be the so referred “fusion”.